Semiconductor Device and Method of Bonding Semiconductor Die to Substrate in Reconstituted Wafer Form

ABSTRACT

A semiconductor device has a plurality of semiconductor die disposed over a carrier. An electrical interconnect, such as a stud bump, is formed over the semiconductor die. The stud bumps are trimmed to a uniform height. A substrate includes a bump over the substrate. The electrical interconnect of the semiconductor die is bonded to the bumps of the substrate while the semiconductor die is disposed over the carrier. An underfill material is deposited between the semiconductor die and substrate. Alternatively, an encapsulant is deposited over the semiconductor die and substrate using a chase mold. The bonding of stud bumps of the semiconductor die to bumps of the substrate is performed using gang reflow or thermocompression while the semiconductor die are in reconstituted wafer form and attached to the carrier to provide a high throughput of the flipchip type interconnect to the substrate.

CLAIM TO DOMESTIC PRIORITY

The present application is a continuation of U.S. patent applicationSer. No. 14/039,092, filed Sep. 27, 2013, which claims the benefit ofU.S. Provisional Application No. 61/740,404, filed Dec. 20, 2012, whichapplications are incorporated herein by reference.

FIELD OF THE INVENTION

The present invention relates in general to semiconductor devices and,more particularly, to a semiconductor device and method of bonding asemiconductor die to a substrate while in reconstituted wafer form andattached to a carrier.

BACKGROUND OF THE INVENTION

Semiconductor devices are commonly found in modern electronic products.Semiconductor devices vary in the number and density of electricalcomponents. Discrete semiconductor devices generally contain one type ofelectrical component, e.g., light emitting diode (LED), small signaltransistor, resistor, capacitor, inductor, and power metal oxidesemiconductor field effect transistor (MOSFET). Integrated semiconductordevices typically contain hundreds to millions of electrical components.Examples of integrated semiconductor devices include microcontrollers,microprocessors, charged-coupled devices (CCDs), solar cells, anddigital micro-mirror devices (DMDs).

Semiconductor devices perform a wide range of functions such as signalprocessing, high-speed calculations, transmitting and receivingelectromagnetic signals, controlling electronic devices, transformingsunlight to electricity, and creating visual projections for televisiondisplays. Semiconductor devices are found in the fields ofentertainment, communications, power conversion, networks, computers,and consumer products. Semiconductor devices are also found in militaryapplications, aviation, automotive, industrial controllers, and officeequipment.

Semiconductor devices exploit the electrical properties of semiconductormaterials. The structure of semiconductor material allows its electricalconductivity to be manipulated by the application of an electric fieldor base current or through the process of doping. Doping introducesimpurities into the semiconductor material to manipulate and control theconductivity of the semiconductor device.

A semiconductor device contains active and passive electricalstructures. Active structures, including bipolar and field effecttransistors, control the flow of electrical current. By varying levelsof doping and application of an electric field or base current, thetransistor either promotes or restricts the flow of electrical current.Passive structures, including resistors, capacitors, and inductors,create a relationship between voltage and current necessary to perform avariety of electrical functions. The passive and active structures areelectrically connected to form circuits, which enable the semiconductordevice to perform high-speed operations and other useful functions.

Semiconductor devices are generally manufactured using two complexmanufacturing processes, i.e., front-end manufacturing, and back-endmanufacturing, each involving potentially hundreds of steps. Front-endmanufacturing involves the formation of a plurality of die on thesurface of a semiconductor wafer. Each semiconductor die is typicallyidentical and contains circuits formed by electrically connecting activeand passive components. Back-end manufacturing involves singulatingindividual semiconductor die from the finished wafer and packaging thedie to provide structural support and environmental isolation. The term“semiconductor die” as used herein refers to both the singular andplural form of the words, and accordingly, can refer to both a singlesemiconductor device and multiple semiconductor devices.

One goal of semiconductor manufacturing is to produce smallersemiconductor devices. Smaller devices typically consume less power,have higher performance, and can be produced more efficiently. Inaddition, smaller semiconductor devices have a smaller footprint, whichis desirable for smaller end products. A smaller semiconductor die sizecan be achieved by improvements in the front-end process resulting insemiconductor die with smaller, higher density active and passivecomponents. Back-end processes may result in semiconductor devicepackages with a smaller footprint by improvements in electricalinterconnection and packaging materials.

In manufacture of a semiconductor package, an individual semiconductordie, such as a flipchip type die, is commonly mounted to a substrate. Anelectrical interconnect, such as a stud bump, can be formed on thesemiconductor die either at the wafer level or individual die level.Achieving uniform height of the stud bumps can be difficult,particularly when formed at the wafer level. The stud bump must then bebonded to an interconnect site on the substrate. The bonding ofindividual semiconductor die to the substrate involves meticuloushandling of the die and substrate and results in a low productionthroughput and higher defect rate.

SUMMARY OF THE INVENTION

A need exists to bond a semiconductor die to a substrate in a manner toachieve high production throughput and low defect rate. Accordingly, inone embodiment, the present invention is a method of making asemiconductor device comprising the steps of providing a reconstitutedpanel including a plurality of semiconductor die, disposing thereconstituted panel over a substrate, and bonding the semiconductor dieto the substrate.

In another embodiment, the present invention is a method of making asemiconductor device comprising the steps of providing a reconstitutedpanel including a plurality of semiconductor die, forming a firstinterconnect structure over the semiconductor die, and disposing thereconstituted panel over a substrate.

In another embodiment, the present invention is a semiconductor devicecomprising a substrate and a reconstituted panel including a pluralityof semiconductor die disposed over the substrate. A first interconnectstructure is formed between the substrate and the semiconductor die withthe first interconnect structure bonded to the substrate and thesemiconductor die of the reconstituted panel.

In another embodiment, the present invention is a semiconductor devicecomprising a substrate. A reconstituted panel including a plurality ofsemiconductor die is disposed over the substrate with the semiconductordie on the reconstituted panel bonded to the substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a printed circuit board (PCB) with different types ofpackages mounted to a surface of the PCB;

FIGS. 2a-2c illustrate further detail of the representativesemiconductor packages mounted to the PCB;

FIGS. 3a-3c illustrate a semiconductor wafer with a plurality ofsemiconductor die separated by a saw street;

FIGS. 4a-4n illustrate a process of bonding a semiconductor die to asubstrate while in reconstituted wafer form with the die attached to thecarrier;

FIG. 5 illustrates a flipchip semiconductor package after singulationfrom the reconstituted wafer of FIGS. 4a -4 n;

FIGS. 6a-6b illustrate a mold underfill of the semiconductor die andsubstrate while in reconstituted wafer form with the die attached to thecarrier;

FIG. 7 illustrates a flipchip semiconductor package after singulationfrom the reconstituted wafer of FIGS. 6a -6 b;

FIGS. 8a-8b illustrate another mold underfill of the semiconductor dieand substrate while in reconstituted wafer form with the die attached tothe carrier; and

FIG. 9 illustrates a flipchip semiconductor package after singulationfrom the reconstituted wafer of FIGS. 8a -8 b.

DETAILED DESCRIPTION OF THE DRAWINGS

The present invention is described in one or more embodiments in thefollowing description with reference to the figures, in which likenumerals represent the same or similar elements. While the invention isdescribed in terms of the best mode for achieving the invention'sobjectives, it will be appreciated by those skilled in the art that itis intended to cover alternatives, modifications, and equivalents as maybe included within the spirit and scope of the invention as defined bythe appended claims and their equivalents as supported by the followingdisclosure and drawings.

Semiconductor devices are generally manufactured using two complexmanufacturing processes: front-end manufacturing and back-endmanufacturing. Front-end manufacturing involves the formation of aplurality of die on the surface of a semiconductor wafer. Each die onthe wafer contains active and passive electrical components, which areelectrically connected to form functional electrical circuits. Activeelectrical components, such as transistors and diodes, have the abilityto control the flow of electrical current. Passive electricalcomponents, such as capacitors, inductors, and resistors, create arelationship between voltage and current necessary to perform electricalcircuit functions.

Passive and active components are formed over the surface of thesemiconductor wafer by a series of process steps including doping,deposition, photolithography, etching, and planarization. Dopingintroduces impurities into the semiconductor material by techniques suchas ion implantation or thermal diffusion. The doping process modifiesthe electrical conductivity of semiconductor material in active devicesby dynamically changing the semiconductor material conductivity inresponse to an electric field or base current. Transistors containregions of varying types and degrees of doping arranged as necessary toenable the transistor to promote or restrict the flow of electricalcurrent upon the application of the electric field or base current.

Active and passive components are formed by layers of materials withdifferent electrical properties. The layers can be formed by a varietyof deposition techniques determined in part by the type of materialbeing deposited. For example, thin film deposition can involve chemicalvapor deposition (CVD), physical vapor deposition (PVD), electrolyticplating, and electroless plating processes. Each layer is generallypatterned to form portions of active components, passive components, orelectrical connections between components.

Back-end manufacturing refers to cutting or singulating the finishedwafer into the individual semiconductor die and then packaging thesemiconductor die for structural support and environmental isolation. Tosingulate the semiconductor die, the wafer is scored and broken alongnon-functional regions of the wafer called saw streets or scribes. Thewafer is singulated using a laser cutting tool or saw blade. Aftersingulation, the individual semiconductor die are mounted to a packagesubstrate that includes pins or contact pads for interconnection withother system components. Contact pads formed over the semiconductor dieare then connected to contact pads within the package. The electricalconnections can be made with solder bumps, stud bumps, conductive paste,or wirebonds. An encapsulant or other molding material is deposited overthe package to provide physical support and electrical isolation. Thefinished package is then inserted into an electrical system and thefunctionality of the semiconductor device is made available to the othersystem components.

FIG. 1 illustrates electronic device 50 having a chip carrier substrateor printed circuit board (PCB) 52 with a plurality of semiconductorpackages mounted on its surface. Electronic device 50 can have one typeof semiconductor package, or multiple types of semiconductor packages,depending on the application. The different types of semiconductorpackages are shown in FIG. 1 for purposes of illustration.

Electronic device 50 can be a stand-alone system that uses thesemiconductor packages to perform one or more electrical functions.Alternatively, electronic device 50 can be a subcomponent of a largersystem. For example, electronic device 50 can be part of a cellularphone, personal digital assistant (PDA), digital video camera (DVC), orother electronic communication device. Alternatively, electronic device50 can be a graphics card, network interface card, or other signalprocessing card that can be inserted into a computer. The semiconductorpackage can include microprocessors, memories, application specificintegrated circuits (ASIC), logic circuits, analog circuits, radiofrequency (RF) circuits, discrete devices, or other semiconductor die orelectrical components. Miniaturization and weight reduction areessential for the products to be accepted by the market. The distancebetween semiconductor devices may be decreased to achieve higherdensity.

In FIG. 1, PCB 52 provides a general substrate for structural supportand electrical interconnect of the semiconductor packages mounted on thePCB. Conductive signal traces 54 are formed over a surface or withinlayers of PCB 52 using evaporation, electrolytic plating, electrolessplating, screen printing, or other suitable metal deposition process.Signal traces 54 provide for electrical communication between each ofthe semiconductor packages, mounted components, and other externalsystem components. Traces 54 also provide power and ground connectionsto each of the semiconductor packages.

In some embodiments, a semiconductor device has two packaging levels.First level packaging is a technique for mechanically and electricallyattaching the semiconductor die to an intermediate carrier. Second levelpackaging involves mechanically and electrically attaching theintermediate carrier to the PCB. In other embodiments, a semiconductordevice may only have the first level packaging where the die ismechanically and electrically mounted directly to the PCB.

For the purpose of illustration, several types of first level packaging,including bond wire package 56 and flipchip 58, are shown on PCB 52.Additionally, several types of second level packaging, including ballgrid array (BGA) 60, bump chip carrier (BCC) 62, dual in-line package(DIP) 64, land grid array (LGA) 66, multi-chip module (MCM) 68, quadflat non-leaded package (QFN) 70, and quad flat package 72, are shownmounted on PCB 52. Depending upon the system requirements, anycombination of semiconductor packages, configured with any combinationof first and second level packaging styles, as well as other electroniccomponents, can be connected to PCB 52. In some embodiments, electronicdevice 50 includes a single attached semiconductor package, while otherembodiments call for multiple interconnected packages. By combining oneor more semiconductor packages over a single substrate, manufacturerscan incorporate pre-made components into electronic devices and systems.Because the semiconductor packages include sophisticated functionality,electronic devices can be manufactured using less expensive componentsand a streamlined manufacturing process. The resulting devices are lesslikely to fail and less expensive to manufacture resulting in a lowercost for consumers.

FIGS. 2a-2c show exemplary semiconductor packages. FIG. 2a illustratesfurther detail of DIP 64 mounted on PCB 52. Semiconductor die 74includes an active region containing analog or digital circuitsimplemented as active devices, passive devices, conductive layers, anddielectric layers formed within the die and are electricallyinterconnected according to the electrical design of the die. Forexample, the circuit can include one or more transistors, diodes,inductors, capacitors, resistors, and other circuit elements formedwithin the active region of semiconductor die 74. Contact pads 76 areone or more layers of conductive material, such as aluminum (Al), copper(Cu), tin (Sn), nickel (Ni), gold (Au), or silver (Ag), and areelectrically connected to the circuit elements formed withinsemiconductor die 74. During assembly of DIP 64, semiconductor die 74 ismounted to an intermediate carrier 78 using a gold-silicon eutecticlayer or adhesive material such as thermal epoxy or epoxy resin. Thepackage body includes an insulative packaging material such as polymeror ceramic. Conductor leads 80 and bond wires 82 provide electricalinterconnect between semiconductor die 74 and PCB 52. Encapsulant 84 isdeposited over the package for environmental protection by preventingmoisture and particles from entering the package and contaminatingsemiconductor die 74 or bond wires 82.

FIG. 2b illustrates further detail of BCC 62 mounted on PCB 52.Semiconductor die 88 is mounted over carrier 90 using an underfill orepoxy-resin adhesive material 92. Bond wires 94 provide first levelpackaging interconnect between contact pads 96 and 98. Molding compoundor encapsulant 100 is deposited over semiconductor die 88 and bond wires94 to provide physical support and electrical isolation for the device.Contact pads 102 are formed over a surface of PCB 52 using a suitablemetal deposition process such as electrolytic plating or electrolessplating to prevent oxidation. Contact pads 102 are electricallyconnected to one or more conductive signal traces 54 in PCB 52. Bumps104 are formed between contact pads 98 of BCC 62 and contact pads 102 ofPCB 52.

In FIG. 2c , semiconductor die 58 is mounted face down to intermediatecarrier 106 with a flipchip style first level packaging. Active region108 of semiconductor die 58 contains analog or digital circuitsimplemented as active devices, passive devices, conductive layers, anddielectric layers formed according to the electrical design of the die.For example, the circuit can include one or more transistors, diodes,inductors, capacitors, resistors, and other circuit elements withinactive region 108. Semiconductor die 58 is electrically and mechanicallyconnected to carrier 106 through bumps 110.

BGA 60 is electrically and mechanically connected to PCB 52 with a BGAstyle second level packaging using bumps 112. Semiconductor die 58 iselectrically connected to conductive signal traces 54 in PCB 52 throughbumps 110, signal lines 114, and bumps 112. A molding compound orencapsulant 116 is deposited over semiconductor die 58 and carrier 106to provide physical support and electrical isolation for the device. Theflipchip semiconductor device provides a short electrical conductionpath from the active devices on semiconductor die 58 to conductiontracks on PCB 52 in order to reduce signal propagation distance, lowercapacitance, and improve overall circuit performance. In anotherembodiment, the semiconductor die 58 can be mechanically andelectrically connected directly to PCB 52 using flipchip style firstlevel packaging without intermediate carrier 106.

FIG. 3a shows a semiconductor wafer 120 with a base substrate material122, such as silicon, germanium, gallium arsenide, indium phosphide, orsilicon carbide, for structural support. A plurality of semiconductordie or components 124 is formed on wafer 120 separated by a non-active,inter-die wafer area or saw street 126 as described above. Saw street126 provides cutting areas to singulate semiconductor wafer 120 intoindividual semiconductor die 124. In one embodiment, semiconductor wafer120 has a width or diameter of 200-300 millimeters (mm). In anotherembodiment, semiconductor wafer 120 has a width or diameter of 100-450mm.

FIG. 3b shows a cross-sectional view of a portion of semiconductor wafer120. Each semiconductor die 124 has a back or non-active surface 128 andactive surface 130 containing analog or digital circuits implemented asactive devices, passive devices, conductive layers, and dielectriclayers formed within the die and electrically interconnected accordingto the electrical design and function of the die. For example, thecircuit may include one or more transistors, diodes, and other circuitelements formed within active surface 130 to implement analog circuitsor digital circuits, such as digital signal processor (DSP), ASIC,memory, or other signal processing circuit. Semiconductor die 124 mayalso contain integrated passive devices (IPDs), such as inductors,capacitors, and resistors, for RF signal processing. In one embodiment,semiconductor die 124 is a flipchip type semiconductor die.

An electrically conductive layer 132 is formed over active surface 130using PVD, CVD, electrolytic plating, electroless plating process, orother suitable metal deposition process. Conductive layer 132 can be oneor more layers of Al, Cu, Sn, Ni, Au, Ag, or other suitable electricallyconductive material. Conductive layer 132 operates as contact padselectrically connected to the circuits on active surface 130. Conductivelayer 132 can be formed as contact pads disposed side-by-side a firstdistance from the edge of semiconductor die 124, as shown in FIG. 3b .Alternatively, conductive layer 132 can be formed as contact pads thatare offset in multiple rows such that a first row of contact pads isdisposed a first distance from the edge of the die, and a second row ofcontact pads alternating with the first row is disposed a seconddistance from the edge of the die.

An insulating or passivation layer 134 is formed over active surface 130using PVD, CVD, printing, lamination, spin coating, spray coating,sintering or thermal oxidation. The insulating layer 134 contains one ormore layers of silicon dioxide (SiO2), silicon nitride (Si3N4), siliconoxynitride (SiON), tantalum pentoxide (Ta2O5), aluminum oxide (Al2O3),or other material having similar insulating and structural properties.Alternatively, insulating layer 134 can be formed before conductivelayer 132. A portion of insulating layer 134 would be removed by anetching process or laser direct ablation (LDA) to expose active surface130 and form conductive layer 132.

Semiconductor wafer 120 undergoes electrical testing and inspection aspart of a quality control process. Manual visual inspection andautomated optical systems are used to perform inspections onsemiconductor wafer 120. Software can be used in the automated opticalanalysis of semiconductor wafer 120. Visual inspection methods mayemploy equipment such as a scanning electron microscope, high-intensityor ultra-violet light, or metallurgical microscope. Semiconductor wafer120 is inspected for structural characteristics including warpage,thickness variation, surface particulates, irregularities, cracks,delamination, and discoloration.

The active and passive components within semiconductor die 124 undergotesting at the wafer level for electrical performance and circuitfunction. Each semiconductor die 124 is tested for functionality andelectrical parameters using a probe or other testing device. A probe isused to make electrical contact with nodes or contact pads 132 on eachsemiconductor die 124 and provides electrical stimuli to the contactpads. Semiconductor die 124 responds to the electrical stimuli, which ismeasured and compared to an expected response to test functionality ofthe semiconductor die. The electrical tests may include circuitfunctionality, lead integrity, resistivity, continuity, reliability,junction depth, electro-static discharge (ESD), radio frequency (RF)performance, drive current, threshold current, leakage current, andoperational parameters specific to the component type. The inspectionand electrical testing of semiconductor wafer 120 enables semiconductordie 124 that pass to be designated as known good die (KGD) for use in asemiconductor package.

In FIG. 3c , semiconductor wafer 120 is singulated through saw street126 using a saw blade or laser cutting tool 136 into individualsemiconductor die 124. The individual semiconductor die 124 can beinspected and electrically tested for identification of KGD postsingulation.

FIGS. 4a-4n illustrate, in relation to FIGS. 1 and 2 a-2 c, a process ofbonding a semiconductor die to a substrate while the die is attached toa carrier. FIG. 4a shows a cross-sectional view of a portion of acarrier or temporary substrate 140. In one embodiment, carrier 140 is atape. A carrier frame 142 is positioned over carrier 140 and secured tothe carrier with an adhesive layer. Carrier 140 and/or carrier frame 142contain sacrificial base material such as silicon, polymer, berylliumoxide, glass, or other suitable low-cost, rigid material for structuralsupport. Carrier frame 142 includes openings 144 for alignment andplacement of semiconductor die 124 over carrier 140.

In FIG. 4b , semiconductor die 124 from FIG. 3c are mounted withinopenings 144 of carrier frame 142 to carrier 140 using, for example, apick and place operation with back surface 128 oriented toward thecarrier. FIG. 4c shows semiconductor die 124 mounted within openings 144of carrier frame 142 to carrier 140 with an adhesive layer asreconstituted or reconfigured wafer 146. FIG. 4d shows a plan view ofsemiconductor die 124 mounted within openings 144 of carrier frame 142to carrier 140 as reconstituted wafer 146.

In another embodiment, FIG. 4e shows a cross-sectional view of a portionof a carrier frame 150. A carrier tape 152 is formed over carrier frame150. Carrier frame 150 and/or carrier tape 152 contain sacrificial basematerial such as silicon, polymer, beryllium oxide, glass, or othersuitable low-cost, rigid material for structural support.

In FIG. 4f , semiconductor die 124 from FIG. 3c are mounted over carriertape 152 and carrier frame 150 using, for example, a pick and placeoperation with back surface 128 oriented toward the carrier tape. FIG.4g shows semiconductor die 124 mounted to carrier tape 152 and carrierframe 150 with an adhesive layer as reconstituted or reconfigured wafer156. FIG. 4h shows a plan view of semiconductor die 124 mounted tocarrier tape 152 and carrier frame 150 as reconstituted wafer 156.

Carrier structures 140-142 and 150-152 can be a round or rectangularpanel (greater than 300 mm) with capacity for multiple semiconductor die124. Carriers 140-142 and 150-152 may have a larger surface area thanthe surface area of semiconductor wafer 120. A larger carrier reducesthe manufacturing cost of the semiconductor package as moresemiconductor die can be processed on the larger carrier therebyreducing the cost per unit. Semiconductor packaging and processingequipment are designed and configured for the size of the wafer orcarrier being processed.

To further reduce manufacturing costs, the size of carriers 140-142 and150-152 is selected independent of the size of semiconductor die 124 orsize of semiconductor wafer 120. That is, carriers 140-142 and 150-152have a fixed or standardized size, which can accommodate various sizesemiconductor die 124 singulated from one or more semiconductor wafers120. In one embodiment, carriers 140-142 and 150-152 are circular with adiameter of 330 mm. In another embodiment, carriers 140-142 and 150-152are rectangular with a width of 560 mm and length of 600 mm.Semiconductor die 124 may have dimensions of 10 mm by 10 mm, which areplaced on the standardized carrier 140-142 or 150-152. Alternatively,semiconductor die 124 may have dimensions of 20 mm by 20 mm, which areplaced on the same standardized carrier 140-142 or 150-152. Accordingly,standardized carrier 140-142 or 150-152 can handle any sizesemiconductor die 124, which allows subsequent semiconductor processingequipment to be standardized to a common carrier, i.e., independent ofdie size or incoming wafer size. Semiconductor packaging equipment canbe designed and configured for the standard carrier using a common setof processing tools, equipment, and bill of materials to process anysemiconductor die size from any incoming wafer size. The common orstandardized carrier 140-142 or 150-152 lowers manufacturing costs andcapital risk by reducing or eliminating the need for specializedsemiconductor processing lines based on die size or incoming wafer size.By selecting a predetermined carrier size to use for any sizesemiconductor die from all semiconductor wafer, a flexible manufacturingline can be implemented.

Reconstituted wafers 146 and 156 can be processed into many types ofsemiconductor packages, including flipchip packages, embedded waferlevel ball grid array (eWLB), fan-in wafer level chip scale packages(WLCSP), reconstituted or embedded wafer level chip scale packages(eWLCSP), fan-out WLCSP, three dimensional (3D) packages, such aspackage-on-package (PoP), or other semiconductor packages. Reconstitutedwafers 146 and 156 are configured according to the specifications of theresulting semiconductor package. In one embodiment, semiconductor die124 are placed on carrier 140-142 or 150-152 in a high-densityarrangement, i.e., 300 micrometers (μm) apart or less, for processingfan-in devices. In another embodiment, semiconductor die 124 areseparated by a distance of 50 μm on carrier 140-142 or 150-152. Thedistance between semiconductor die 124 on carrier 140-142 or 150-152 isoptimized for manufacturing the semiconductor packages at the lowestunit cost. The larger surface area of carrier 140-142 or 150-152accommodates more semiconductor die 124 and lowers manufacturing cost asmore semiconductor die 124 are processed per reconstituted wafer 146 or156. The number of semiconductor die 124 mounted to carrier 140-142 or150-152 can be greater than the number of semiconductor die 124singulated from semiconductor wafer 120. Carriers 140-142 and 150-152and reconstituted wafers 146 and 156 provide the flexibility tomanufacture many different types of semiconductor packages usingdifferent size semiconductor die 124 from different sized semiconductorwafers 120.

The remaining discussion is directed to reconstituted wafer 146containing semiconductor die 124 mounted to carrier 140 and carrierframe 142, although the same principles apply to reconstituted wafer 156containing semiconductor die 124 mounted to carrier frame 150 andcarrier tape 152. Continuing from FIG. 4c , a plurality of electricalinterconnects or stud bumps 160 are formed over conductive layer 132 ofsemiconductor die 124 while in reconstituted wafer form with thesemiconductor die attached to carrier 140 and carrier frame 142, asshown in FIG. 4i . Stud bumps 160 include a base portion 160 a and stemportion 160 b. Conductive material 164, such as Au, Ag, Cu, Al, or alloythereof, is dispensed or extruded from applicator 162 to form stud bumps160. Stud bumps 160 are trimmed, cut, planarized, or otherwise leveledto a desired uniform height, such as 10-100 μm. FIG. 4j shows a planview of stud bumps 160 formed over conductive layer 132 of semiconductordie 124 disposed within openings 144 of carrier frame 142 over carrier140.

FIG. 4k shows substrate or PCB 170 containing insulating material 172and conductive layers 174. In one embodiment, substrate 170 contains oneor more laminated layers of prepreg, FR-4, FR-1, CEM-1, or CEM-3 with acombination of phenolic cotton paper, epoxy, resin, woven glass, matteglass, polyester, and other reinforcement fibers or fabrics. Substrate170 can also be a multi-layer flexible laminate, ceramic, copper foil,glass, or semiconductor wafer including an active surface containing oneor more transistors, diodes, and other circuit elements to implementanalog circuits or digital circuits. The insulating material 172 maycontain one or more layers of SiO2, Si3N4, SiON, Ta2O5, Al2O3, hafniumoxide (HfO2), benzocyclobutene (BCB), polyimide (PI), polybenzoxazoles(PBO), polymer, or other dielectric material having similar structuraland insulating properties. Conductive layers 174 contain Al, Cu, Sn, Ni,Au, Ag, Ti, W, or other suitable electrically conductive material formedusing a patterning and metal deposition process such as sputtering,electrolytic plating, and electroless plating. Conductive layers 174include lateral redistribution layers (RDL) and vertical conductive viasto provide electrical interconnect through substrate 170. Portions ofconductive layers 174 are electrically common or electrically isolatedaccording to the design and function of the semiconductor die 124mounted to substrate 170.

An electrically conductive bump material is deposited over conductivelayer 174 using an evaporation, electrolytic plating, electrolessplating, ball drop, or screen printing process. The bump material can beAl, Sn, Ni, Au, Ag, Pb, Bi, Cu, solder, and combinations thereof, withan optional flux solution. For example, the bump material can beeutectic Sn/Pb, high-lead solder, or lead-free solder. The bump materialis bonded to conductive layer 174 using a suitable attachment or bondingprocess. In one embodiment, the bump material is reflowed by heating thematerial above its melting point to form balls or bumps 176. In someapplications, bumps 176 are reflowed a second time to improve electricalcontact to conductive layer 174. Bumps 176 can also be compressionbonded or thermocompression bonded to conductive layer 174. Bumps 176represent one type of interconnect structure that can be formed overconductive layer 174. The interconnect structure can also use conductivepaste, stud bump, micro bump, or other electrical interconnect.

Heat tip 180 is mounted to carrier 140 and carrier frame 142 ofreconstituted wafer 146 for bonding of stud bumps 160 to bumps 176 ofsubstrate 170. Reconstituted wafer 146 is positioned over substrate 170with stud bumps 160 aligned to bumps 176. Stud bumps 160 are broughtinto contact with bumps 176 to form an electrical and metallurgicalunion using gang reflow or thermocompression bonding with the aid ofheat tip 180. Heat tip 180 applies a force F under an elevatedtemperature for the reflow or thermocompression bonding of stud bumps160 to bumps 176. FIG. 4l shows stud bumps 160 electrically andmetallurgically bonded to bumps 176. The bonding of stud bumps 160 ofsemiconductor die 124 to bumps 176 of substrate 170 is performed usinggang reflow or thermocompression while the semiconductor die are inreconstituted wafer form and attached to carrier 140 and carrier frame142 (or carrier frame 150 and carrier tape 152) to provide a highthroughput of the flipchip type interconnect to the substrate.

In FIG. 4m , heat tip 180 is removed, as well as carrier 140 and carrierframe 142, by chemical etching, mechanical peeling, chemical mechanicalplanarization (CMP), mechanical grinding, thermal bake, UV light, laserscanning, or wet stripping to expose back surface 128 of semiconductordie 124.

In FIG. 4n , an underfill material 182, such as epoxy resin, isdeposited between semiconductor die 124 and substrate 170. Underfillmaterial 182 can be deposited by a capillary underfill process.Alternatively, a non-conductive paste or non-conductive film can beapplied to substrate 170 prior to attaching semiconductor die 124. Bumps184 are formed over conductive layer 174 on a surface of substrate 170opposite semiconductor die 124. Semiconductor die 124 are singulatedthrough substrate 170 with saw blade or laser cutting tool 186 intoindividual flipchip packages 188.

FIG. 5 shows flipchip package 188 after singulation. Semiconductor die124 is electrically connected through stud bumps 160 and bumps 176 toconductive layer 174 and bumps 184 of substrate 170 for externalinterconnect. The bonding of stud bumps 160 of semiconductor die 124 tobumps 176 of substrate 170 is performed using gang reflow orthermocompression while the semiconductor die are in reconstituted waferform and attached to carrier 140 and carrier frame 142 (or carrier frame150 and carrier tape 152) to provide a high throughput of the flipchiptype interconnect to the substrate. The flipchip package 188 may undergoinspection and electrical testing before or after singulation.

In another embodiment, continuing from FIG. 4m , semiconductor die 124and substrate 170 are placed in chase mold 190, as shown in FIG. 6a .Chase mold 190 includes an upper mold support 192 and lower mold support194. Upper mold support 192 has a cavity for containing semiconductordie 124, substrate 170, and encapsulant or molding compound.Semiconductor die 124 and substrate 170 are placed over lower moldsupport 194 with a surface of the substrate, opposite the semiconductordie, contacting the lower mold support. The upper mold support 192 andlower mold support 194 are brought together to close chase mold 190. Avolume of encapsulant or molding compound 196 is injected under anelevated temperature and pressure through inlet 198 to coversemiconductor die 124 and substrate 170. Encapsulant 196 can be apolymer composite material, such as epoxy resin with filler, epoxyacrylate with filler, or polymer with proper filler. In particular,encapsulant 196 covers the four side surfaces, back surface 128 ofsemiconductor die 124, and an area between the semiconductor die andsubstrate. The volume of encapsulant 196 is measured according to thespace requirements of the chase mold cavity less the area occupied bysemiconductor die 124 and substrate 170. Encapsulant 196 is evenlydispersed and uniformly distributed under an elevated temperature withinchase mold 190 around and between semiconductor die 124 and substrate170. In one embodiment, the molding temperature ranges from 80-150° C.with a molding time of 250-1000 seconds. The molding cure temperatureranges from 100-180° C. with a molding cure time of 20-120 minutes.Encapsulant 196 is non-conductive and environmentally protects thesemiconductor device from external elements and contaminants.

In FIG. 6b , semiconductor die 124 and substrate 170 are removed fromchase mold 190. Bumps 200 are formed over conductive layer 174 on asurface of substrate 170 opposite semiconductor die 124. Semiconductordie 124 are singulated through substrate 170 with saw blade or lasercutting tool 202 into individual flipchip packages 204.

FIG. 7 shows flipchip package 204 after singulation. Semiconductor die124 is electrically connected through stud bumps 160 and bumps 176 toconductive layer 174 and bumps 200 of substrate 170 for externalinterconnect. The bonding of stud bumps 160 of semiconductor die 124 tobumps 176 of substrate 170 is performed using gang reflow orthermocompression while the semiconductor die are in reconstituted waferform and attached to carrier 140 and carrier frame 142 (or carrier frame150 and carrier tape 152) to provide a high throughput of the flipchiptype interconnect to the substrate. The flipchip package 204 may undergoinspection and electrical testing before or after singulation.

In another embodiment, continuing from FIG. 4m , semiconductor die 124and substrate 170 are placed in chase mold 210, as shown in FIG. 8a .Chase mold 210 includes an upper mold support 212 and lower mold support214. Upper mold support 212 has a cavity for containing semiconductordie 124, substrate 170, and encapsulant or molding compound.Semiconductor die 124 and substrate 170 are placed over lower moldsupport 214 with a surface of the substrate, opposite the semiconductordie, contacting the lower mold support. The upper mold support 212 andlower mold support 214 are brought together to close chase mold 210.Back surface 128 of semiconductor die 124 contacts sealing layer 217 ofupper mold support 212 to block formation of encapsulant 216 over theback surface of the semiconductor die. A volume of encapsulant ormolding compound 216 is injected under an elevated temperature andpressure through inlet 218 to cover semiconductor die 124 and substrate170. Encapsulant 216 can be a polymer composite material, such as epoxyresin with filler, epoxy acrylate with filler, or polymer with properfiller. In particular, encapsulant 216 covers the four side surfaces ofsemiconductor die 124, as well as between the semiconductor die andsubstrate. Back surface 128 remains devoid of encapsulant 216. Thevolume of encapsulant 216 is measured according to the spacerequirements of the chase mold cavity less the area occupied bysemiconductor die 124 and substrate 170. Encapsulant 216 is evenlydispersed and uniformly distributed under an elevated temperature withinchase mold 210 around semiconductor die 124. In one embodiment, themolding temperature ranges from 80-150° C. with a molding time of250-1000 seconds. The molding cure temperature ranges from 100-180° C.with a molding cure time of 20-120 minutes. Encapsulant 216 isnon-conductive and environmentally protects the semiconductor devicefrom external elements and contaminants.

In FIG. 8b , semiconductor die 124 and substrate 170 are removed fromchase mold 210. Bumps 220 are formed over conductive layer 174 on asurface of substrate 170 opposite semiconductor die 124. Semiconductordie 124 are singulated through substrate 170 with saw blade or lasercutting tool 222 into individual flipchip packages 224.

FIG. 9 shows flipchip package 224 after singulation. Semiconductor die124 is electrically connected through stud bumps 160 and bumps 176 toconductive layer 174 and bumps 220 of substrate 170 for externalinterconnect. The bonding of stud bumps 160 of semiconductor die 124 tobumps 176 of substrate 170 is performed using gang reflow orthermocompression while the semiconductor die are in reconstituted waferform and attached to carrier 140 and carrier frame 142 (or carrier frame150 and carrier tape 152) to provide a high throughput of the flipchiptype interconnect to the substrate. The flipchip package 224 may undergoinspection and electrical testing before or after singulation.

While one or more embodiments of the present invention have beenillustrated in detail, the skilled artisan will appreciate thatmodifications and adaptations to those embodiments may be made withoutdeparting from the scope of the present invention as set forth in thefollowing claims.

What is claimed:
 1. A method of making a semiconductor device,comprising: providing a reconstituted panel including a plurality ofsemiconductor die; disposing the reconstituted panel over a substrate;and bonding the semiconductor die to the substrate.
 2. The method ofclaim 1, further including forming an interconnect structure over thesemiconductor die, wherein bonding the semiconductor die to thesubstrate further includes bonding the interconnect structure to thesubstrate.
 3. The method of claim 2, wherein the interconnect structureincludes a bump or a stud bump.
 4. The method of claim 1, furtherincluding simultaneously bonding the semiconductor die to the substrateby thermocompression bonding.
 5. The method of claim 1, furtherincluding depositing an encapsulant or underfill material between thesemiconductor die and substrate.
 6. The method of claim 1, furtherincluding singulating the substrate after bonding the semiconductor dieto the substrate.
 7. A method of making a semiconductor device,comprising: providing a reconstituted panel including a plurality ofsemiconductor die; forming a first interconnect structure over thesemiconductor die; and disposing the reconstituted panel over asubstrate.
 8. The method of claim 7, further including: forming a secondinterconnect structure over the substrate; and bonding the firstinterconnect structure to the second interconnect structure.
 9. Themethod of claim 7, wherein providing the reconstituted panel furtherincludes: providing a carrier; and disposing the semiconductor die overthe carrier.
 10. The method of claim 9, further including forming thefirst interconnect structure over the semiconductor die while thesemiconductor die are disposed over the carrier.
 11. The method of claim9, further including bonding the first interconnect structure to thesubstrate while the semiconductor die are disposed over the carrier. 12.The method of claim 7, further including bonding the first interconnectstructure to the substrate using thermocompression.
 13. The method ofclaim 7, further including depositing an encapsulant or an underfillmaterial between the semiconductor die and substrate.
 14. Asemiconductor device, comprising: a substrate; a reconstituted panelincluding a plurality of semiconductor die disposed over the substrate;and a first interconnect structure formed between the substrate and thesemiconductor die with the first interconnect structure bonded to thesubstrate and the semiconductor die of the reconstituted panel.
 15. Thesemiconductor device of claim 14, wherein the first interconnectstructure includes a bump or a stud bump.
 16. The semiconductor deviceof claim 14, further including a second interconnect structure formedover the substrate with the first interconnect structure bonded to thesecond interconnect structure.
 17. The semiconductor device of claim 14,wherein the reconstituted panel further includes the semiconductor diedisposed over a carrier.
 18. The semiconductor device of claim 14,wherein the substrate includes a printed circuit board.
 19. Thesemiconductor device of claim 14, further including an encapsulant or anunderfill material deposited between the semiconductor die andsubstrate.
 20. A semiconductor device, comprising: a substrate; and areconstituted panel including a plurality of semiconductor die disposedover the substrate with the semiconductor die on the reconstituted panelbonded to the substrate.
 21. The semiconductor device of claim 20,wherein the reconstituted panel further includes the semiconductor diedisposed over a carrier.
 22. The semiconductor device of claim 20,further including an interconnect structure formed over thesemiconductor die of the reconstituted panel, the interconnect structurebonded to the substrate.
 23. The semiconductor device of claim 22,wherein the interconnect structure includes a bump or a stud bump. 24.The semiconductor device of claim 20, wherein the substrate includes aprinted circuit board.
 25. The semiconductor device of claim 20, furtherincluding an encapsulant or underfill material deposited between thesemiconductor die and substrate.